YAMAHA Modular High-Speed Mounter
New type electronic devices are released one after another. To ensure merchandise
power of these products, higher performance and functions, portability
and integration, constant cost reducing efforts, quality stability and
environment consious are indispensable. Also, downsizing, higher density,
new type mouting and measures for lead-free requirement are becoming essential
in the SMT technology. YAMAHA meets such needs of the age with its advanced
modular high-precision high-speed machine having an excellent mouting accuracy,
applicability to a wide range of components and high-quality solder paste
printing function.
OUTLINE
YAMAHA YV100Xg
High-speed, high-precision, general-purpose modular mounter with 8 in-line
multi-heads highlights speed and precision
|
●Features
■High-speed mounting of 0.18 sec/chip (under optimum conditions).
■16,200 CPH (0.22 sec/chip) achieved under IPC9850 condition.
■Mounting accuracy of +/- 50micron (absolute accuracy :μ+3σ＜50μm)
assured full time for 0603 components. Repeatabiligy of +/-30 micron (3σ＜30μm)
assured at full time.
■Continuously all-ball recognition of CSP/BGA including judgement of flaws
and defects.
■Accomodation of wide range components, from 0603 to □31mm QFP.
■Ideal for the next generation memory module. |
|
●Basic Specification
Dimentions: 1,650(L) x 1,408(W) x 1,850(H)mm
Main unit weight: approx. 1,600kg
|
|
|
|
|
YAMAHA YV100XTg
Modular mounter fitted with two rows of 8 in-line multi-heads Ultra high
speed of 0.135 sec/chip
|
●Features
■Ultra-high-speed mounting of 0.135 sec/chip (under optimum conditions).
■22,000 CPH (0.16 sec/chip) achieved under IPC9850 condition.
■Mounting accuracy of +/- 50micron (absolute accuracy :μ+3σ＜50μm)
assured full time for 0603 components. Repeatabiligy of +/-30 micron (3σ＜30μm)
assured at full time.
■The frame is the same size and shape as that of the YV100Xg and YV88Xg,
for high flexbility when changing and moving assembly line.
■Continuously all-ball recognition of CSP/BGA including judgement of flaws
and defects.
■Fitted with two rows of 8 in-line multi-heads, in mechanical layout that
avoids interference and impact.
Layout guarantees easy access for maintenance.
■Accomodation of wide range components, from 0603 to □31mm QFP. |
|
●Basic Specification
Dimentions:
M class 1,650(L) x 1,408(W) x 1,850(H)mm
L class 1,650(L) x 1,412(W) x 1,850(H)mm
Main unit weight: approx. 1,750kg
|
|
|
YAMAHA YV180Xg
Modular chip shooter fitted with two rows of 8 in-line multi-heads and
two independent tables Ultra-high-speed of 0.095 sec/chip
|
●Features
■Ultra-high-speed mounting of 0.095 sec/chip (under optimum conditions).
■30,600 CPH (0.118 sec/chip) achieved under IPC9850 condition.
■Mounting accuracy of +/- 50micron (absolute accuracy :μ+3σ＜50μm)
assured full time for 0603 components. Repeatabiligy of +/-30 micron (3σ＜30μm)
assured at full time.
■Requires a floor space of a middle size mounter yet provides performance
equivalent to a high speed mounter.
■Fitted with two rows of 8 in-line multi-heads, in mechanical layout that
avoids interference and impact.
Layout guarantees easy access for maintenance.
■Accomodation of wide range components, from 0603 to □31mm QFP. |
|
●Basic Specification
Dimentions:
M/L class 1,950(L) x 1,630(W) x 2,000(H)mm
Main unit weight: approx. 2,080kg
|
|
|
|
|
YAMAHA YV88Xg
Ultra-high-precision, general-purpose modular mounter highlights ultimate
accuracy, wide-flexibility and multi-function
|
●Features
■Mounting accuracy of +/- 30micron (absolute accuracy :μ+3σ＜30μm)
assured full time for QFP, BGA and CSP. Repeatabiligy of +/-20 micron (3σ＜20μm)
assured at full time.
■Mounting accuracy of +/- 50micron (absolute accuracy :μ+3σ＜50μm) assured full time for 0603 components. Repeatabiligy of +/-30 micron (3σ＜30μm) assured at full time.
■Continuously all-ball recognition of CSP/BGA, including judgement of flaws and defects.
■Consecutive mounting at 0.9 sec/QFP (□31mm, 0.5mm pitch).
■Versatility of wide range components by field-of-view selection.
|
|
●Basic Specification
Dimentions:
M/L type 1,650(L) x 1,408(W) x 1,850(H)mm
Main unit weight: approx. 1,600kg
|
|
|
|
|
YAMAHA HSD-Xg
High-end dispenser, developed in pursuit of stability, flexibility and high dispensing speed
|
●Features
■Fast dispensing speed of 0.09sec/shot (under optimum conditions).
■Separate independent Z and R axis heads adopted.
■Up to three heads can be installed, ensuring applicability to all dispensing
conditions.
■Dispensing feedback function (dot station and image recognition) can automatically correct dispensing volume.
■Usable for dispensing of solder paste for 1608 components (dispensing
solder paste for 1005 components needs to be discussed). |
|
●Basic Specification
Dimentions: 1,650(L) x 1,408(W) x 1,850(H)mm
Main unit weight: approx .1,530kg
|
|
|
 |
●Features
■Capable of handling SMD components and semiconductor components mounted
in mixture.
■Optimum for manufacturing process and trial manufacture of MCM, SIP and
module components for cellular phones.
■Mounting accuracy: Assurance of absolute accuracy +/-20μm (μ+3σ),
+/-12.5μm (3σ)
■Load control: 1N ~ 49N
■Production history: Interface commonly usable with Xg series (Emphasis
on traceability.
■Component supply configuration:
2, 4inch waffle tray (equipped with auto-changer)/
6, 8inch wafer / 8 to 56 nm tape / Bulk / Stick /
Syringe for dispensing: 30cc, 10cc |
|
●Basic Specification
Dimentions: 1350(L) x 1,408(W) x 1,850(H)mm
Main unit weight: approx. 1,300kg
|
|
|
|
|
 |
|
●Basic
Specification
Dimentions:
CL8mm7''
tape feeder type: 995(L) x 1,275(W) x 1,350(H)mm
Large
sized feeder type: 1,195(L) x 1,275(W) x 1,350(H)mm
Main
unit weight: approx. 750kg
|
|
|
|
|
|
|
